SiGen News

SiGen News Releases

SiGen is consistently featured in the industry press as a leading innovator of advanced substrate solutions, for solar, semiconductor, display, and the optoelectronics markets. SiGen's successes illustrate the company's ability to analyze and solve a diverse set of challenges present in the solar, semiconductor, and other marketplaces. Click on the highlighted links to access the latest press releases.

Press Releases

08/31/23	Silicon Genesis Extends its Nanocleave Layer Transfer Technology with New 3DIC Initiatives (PDF 145KB)
03/02/23	3DIC: Silicon Genesis works with its Customers to enhance CMOS Performance by Stacking Wafer Scale Integrated Circuits Vertically using its Proprietary Nanocleave Layer Transfer Techniques (PDF 160KB)
01/27/23	Silicon Genesis continues its focus on Customer Specific 3DIC Applications using its SiGen NanoTec suite of technology offerings and SiGen Nanocleave Layer Transfer Process Technology (PDF 153KB)
04/03/17	Silicon Genesis has focused its technology development efforts into the emerging 3DIC application markets (PDF 118KB)
03/31/17	Silicon Genesis announces end of its ITC patent lawsuit against Soitec (PDF 117KB)
03/19/12	Silicon Genesis Announces its Second Generation Polymax™ Production Equipment for Thin Solar Wafering (PDF 117KB)
09/02/11	Silicon Genesis to Present at the 26th European Photovoltaic Solar Energy Conference and Exhibition (PDF 47KB)
09/02/10	Silicon Genesis Starts the PolyMax™ Production System (PDF 115KB)
03/26/09	SiGen's 20um Wafer Featured on Bloomberg TV
03/04/09	Silicon Genesis Bridges the Gap with 20um "kerf-free" PV Foil (PDF 80KB)
11/13/08	SiGen and NorSun AS Establish Equipment Supply Agreement (PDF 73KB)
11/06/08	Silicon Genesis New Facility Starts Production of 150um "Kerf-free" PV Wafers (PDF 73KB)
08/12/08	Silicon Genesis and REC ASA Sign Collaboration and Equipment Supply Agreement PDF (104KB)
07/11/08	Silicon Genesis Enters the Solar PV Market with Revolutionary Wafering Technology SiGen's innovative "kerf-free" wafering equipment moves into pilot line (PDF 1.8MB)
07/17/07	SiGen Displays Latest Layer Transfer Technology at SEMICON West 2007 Layer Transfer equipment and process technology for SOI, SOQ, SOG, DSB (PDF 25.3KB)

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