THE SEMICONDUCTOR INDUSTRY HAS LONG RELIED ON THE EVOLUTION OF PROCESS TECHNOLOGY TO INCREASE DEVICE PERFORMANCE, REDUCE POWER CONSUMPTION AND DIE COST.
Introducing layers on silicon wafers has been fundamental to the fabrication of integrated circuits. Growing, depositing, and modifying layers to form complex structures or functions is the foundation of semiconductor processing technology today. Many of the same semiconductor layer formation and processing techniques have been applied to other applications. However, as semiconductor technology continually moves toward smaller feature sizes and greater density (Moore's Law), newer layer formation technologies are required to meet future requirements for thin film engineered substrates without modification or extension.